日程公布！AI for Engineering International Conference——智赋工程·科学未来研讨会
发表时间:  2026-06-01    阅读量:  148

 

为推动智能技术与工程学科的深度交叉融合，促进领域内杰出学者与行业专家开展学术对话、实现协同创新，MDPI与香港科技大学将联合举办AI for Engineering International Conference——智赋工程·科学未来研讨会。本次会议以人工智能与工程科学交叉创新及工程化落地为核心主题，旨在为海内外学者搭建高水平、国际化的学术交流平台，欢迎广大学者关注与参与。

 

 

研讨会信息

 

时间：2026年6月12-14日

 

地点：Kaisa Group Lecture Theater (IAS LT), Lo Ka Chung Building, Lee Shau Kee Campus, The Hong Kong University of Science and Technology (Clear Water Bay, Kowloon, Hong Kong)

 

主办单位：MDPI，香港科技大学

主席：

 


郭毅可 院士

香港科技大学

 

支持期刊：AI for Engineering、AI、AI Chemistry、AI Materials、AI Sensors、AI in Education、AI in Medicine

 

议题：

 

材料与化学工程中的人工智能

生物医学与地球系统中的人工智能

智能制造与具身智能

人工智能的未来

 

 

研讨会日程

Time / Session Details
Arrival—Friday, 12 June  
14:00–18:00 Speakers/Guests Arrival Registration (The Royal Garden Kowloon East)
Day 1—Saturday, 13 June  
08:30–09:00 Registration & Coffee
09:00–09:15 Welcome & Opening (with Photo Session)
09:15–09:45 Launch Ceremony for the New Journal AI for Engineering
09:45–11:00

Theme 1 "Earth and Environmental Engineering"
Panel Chair: Mengqian Lu (HKUST)

• Keynote Speaker:

Libo Wu (Fudan University)

• Panel Members:

1. Yi-Qing Ni (PolyU)
2. Jian-Guo Dai (CityU)
3. Guanghao Chen (HKUST)
4. Qing Bao (CAS)
11:00–11:15 Coffee Break
11:15–12:30

Theme 2 "Logistics and Embodied AI"
Panel Chairs: Mo Li & Jiheng Zhang (HKUST)

• Keynote Speaker:

Desheng Zhang (Rutgers University and JD)

• Panel Members:

1. Jing Wu (CUHK)
2. Desheng Zhang (Rutgers University and JD)
3. Guanghui Wen (Southeast University) (TBC)
4. Jiheng Zhang (HKUST)
5. Mo Li (HKUST)
12:30–13:45 Lunch
14:00–15:15

Theme 3 "Materials Engineering"
Panel Chair: Yuanyuan Zhou (HKUST)

• Keynote Speaker:

Sergei V. Kalinin (UTK) (TBC)

• Panel Members:

1. Zhiyong Fan (HKUST) (TBC)
2. Shijin Sun (Cambridge) (TBC)
3. Lijun Zhang (Jilin University) (TBC)
4. Yuanmiao Sun (Shenzhen Institute of Advanced Technology) (TBC)
5. Jian Ma (XtalPi)
6. Haitao Zhao (PolyU)
7. Wanjian Yin (Soochow University)
15:15–15:30 Coffee Break
15:30–16:45

Theme 4 "Biomedical Engineering"
Panel Chairs: Qian Zhang & Xiaomeng Li (HKUST)

• Keynote Speaker:

Xiaonan Wang (Tsinghua University) (TBC)

• Panel Members:

1. Hanyu Gao (HKUST)
2. Jun Xia (HKUST-GZ)
3. Shi Xuan Leong (Nanyang Technological University)
4. Yiming Mo (Zhejiang University)
5. Binju Wang (Xiamen University)
16:45–18:00 (continued from above — Panel Members list)
18:30 Wrap-up
Day 2—Sunday, 14 June  
08:30–9:00 Registration & Coffee
09:00–10:15

Theme 6 "Future of AI"
Panel Chair: Xiaofang Zhou (HKUST)

• Keynote Speaker:

Lei Chen (HKUST GZ) (TBC)

• Panel Members:

1. Lei Chen (HKUST GZ)
2. Ping Tan (HKUST)
3. Gao Cong (Huawei)
4. James Kwok (HKUST)
5. Benben Jiang (Tsinghua University)
10:15–10:45 MDPI Engineering Journals and AI in Academic Publishing
Milica Plazinic (MDPI)
10:45–12:00

Theme 7 "Manufacturing"
Panel Chair: Song Guo (HKUST)

• Keynote Speaker:

Jian Lu (CityU)

• Panel Members:

1. Shenghua Gao (HKU)
2. Jianguo Lin (PolyU)
3. Qifeng Chen (HKUST)
4. Naipeng Li (Xi’an Jiaotong University) (TBC)
12:00–12:15 Closing

 

日程将根据实际情况持续完善、补充与更新，敬请关注。

 

 

报名须知

 

本次研讨会旨在为智能技术与工程科学领域的研究者提供一个交流最新研究成果、探讨前沿问题以及交流科研心得的平台。参会者无需缴纳注册费，提供6月13日茶歇及自助午餐，差旅费用自理。名额有限，如您有兴趣参加，请通过以下链接提交报名表，报名成功后工作人员会向您发送确认通知信，请您注意查收邮件。

报名截止时间：2026年6月5日


点击下方链接，提交报名表。

https://forms.cloud.microsoft/e/B5jzmSr7RX

 

 

会议咨询

 

如需了解更多信息或有任何疑问，欢迎联系MDPI市场部邮箱<mktplan@mdpi.com>或扫描下方二维码添加工作人员企业微信。

 


联系人：付沂萌

 

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